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双组份1.2w导热灌封胶是一种低粘度阻燃性双组分加成型有机硅导热灌封胶，混合后可室温固化，也可以加热固化，具有温度越高固化越快的特点。可以应用于PC(Poly-carbonate)、PP、ABS、PVC等材料及金属类的表面。适用于电子配件导热、绝缘、防水及阻燃，其阻燃性可以达到UL94-V0级。完全符合欧盟ROHS指令要求。
应用范围
● 电源模块、电子元器件深层灌封，特别适用于HID电源模块灌封
● 户外LED显示屏的灌封
● TV、CRT、电源、通讯设备等电子电气元器件的机械粘接密封以及电子元器件的粘接固定
● 其它有阻燃要求的金属、塑料、玻璃等粘接密封
下面是TIE120AB的基本参数：
Typical Uncured Material:
TIE 120-A | TIE 120-B | |
Color | Black | Black |
Viscosity@25℃ Brookfield | 3,000 cPs | 5,000 cPs |
Specific Gravity | 1.6 g/cc | / |
Shelf life @25℃ in sealed container | 12 months | 12 months |
Mix Ratio (By weight):
TIE 120A : TIE 120B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃ 45 min
Specific Gravity 1.6 g/cc
Cure Schedule:
Cure 12 hours at 25℃
Cure 30 minutes at 70℃
Cured Properties:
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +30℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion, /℃ 3.0 X 10¯5
Fire resistance UL Meet 94 V-0
moisture absorption % wt gain 24 hours 0.1
water immersion @25℃
Thermal:
Thermal Conductivity 1.2 W/m-K
Thermal Impedance @10psi 0.36℃- in/W
ELECTRICAL AS CURED:
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012